Flexible Circuit Board
Unmatched versatility of flex printed circuits and flexible printed circuit boards makes them perfect for simple or complex applications.
More Information
|
Flexible Circuit Board |
|||
|
Item |
Usual |
Unusual |
|
|
PCB Layers |
1 – 12 layers |
||
|
Laminate | Material |
Flexible part: DuPont PI, Shengyi PI |
||
|
Rigid part: PI/FR4 |
|||
|
FR4, for lead-free welding |
|||
|
low-loss material |
|||
|
Halogen free |
|||
|
Special materials: Rogers/Arlon/Nelco/Taconic etc |
|||
|
PTFE |
|||
|
Polyimide |
|||
|
Delivery Size |
Delivery Size |
570X610mm |
570X610mm |
|
Production size |
610X640mm |
610X640mm |
|
|
Board Thickness |
thinnest |
0.25 mm |
0.20 mm |
|
thickest |
5.00 mm |
5.50 mm |
|
|
Finished board thickness tolerance |
±2mil(±0.04m) |
||
|
Copper Thickness |
Inner Layer |
1/3-28 OZ |
1/3-30 OZ |
|
Outer Layer |
1/7-28 OZ |
1/7-30 OZ |
|
|
Inner Line |
Minimum line width |
50μm |
50μm |
|
Minimum line spacing |
75μm |
50μm |
|
|
Outer Line |
Minimum line width |
75μm |
50μm |
|
Minimum line spacing |
75μm |
50μm |
|
|
Min. mechanical Via hole, minimum pad |
inner Layer |
0.45 mm |
0.40 mm |
|
Outer Layer |
0.40 mm |
0.35 mm |
|
|
Laser Via hole minimum pad |
inner Layer |
0.25 mm |
0.23 mm |
|
Outer Layer |
0.25 mm |
0.23 mm |
|
|
Thickness to diameter ratio |
LBMV |
1:01 |
1:01 |
|
MVTH |
1:12 |
1:16 |
|
|
Min. dielectric thickness |
Inner core board |
0.025 mm |
0.025 mm |
|
Prepreg |
0.05 mm |
0.05 mm |
|
|
Solder resist |
min. spacing |
60 μm |
40 μm |
|
Min. Solder resist bridge |
75 μm |
65 μm |
|
|
Buried capacitance |
Insulation thickness: 14 μm |
||
|
unit-area capacitance: 6.4 nF/in2 |
|||
|
Breakdown voltage: >100V |
|||
|
Buried resistor |
Resistance per unit area(ohms/sq.) : 25, 50, 100, 200 |
||
|
Impedance control accuracy |
10% |
5% |
|
|
Plug hole |
ink plughole |
||
|
resin plug holes |
|||
|
copper slurry plughole |
|||
|
Min Tracing/Spacing |
2.5mil/2.5mil |
||
|
Min. Annular Ring |
4mil |
||
|
Min. Drilling Hole Diameter |
8mil(0.15mm) |
||
|
Min. mechanical drilling |
0.15 mm |
0.15 mm |
|
|
Laser aperture |
0.10-0.2 0mm |
0.10-0.20 mm |
|
|
Min. finished via diameter |
6mil(0.15mm) |
||
|
Tolerance of dimension |
3mil(0.076 mm) |
||
|
Solder Mask Color |
Green, White, Blue, Black, Red, Yellow |
||
|
Silkscreen Color |
White, Black, Yellow |
||
|
Surface Finish |
OSP |
||
|
HASL(Hot Air Solder Leveling) |
|||
|
HASL Lead-Free |
|||
|
Flash Gold |
|||
|
ENIG (Electroless Nickle/Immersion Gold) |
|||
|
Immersion Tin |
|||
|
Immersion Silver |
|||
|
Special technologies |
Impedance Control+/-10% |
||
|
Gold fingers |
|||
|
Stiffener (PI/FR4) |
|||
|
Peelable solder mask |
|||