HDI (High Density Interconnect) PCB Process Capability

Item

batch

Template

layers

4-16 Layers

4-24 Layers

Plate thickness range

0.6-3.2mm

0.4-6.0mm

highest order

4+N+4

Any layer innterconnected

Minimum laser hole

4mil (0.1mm)

3mil (0.075mm)

Laser process

CO2 Laser Machine

CO2 Laser Machine

Tg value

140/150/170°C

140/150/170°C

hole copper

12-18μm

12-18μm

Impedance tolerance

+/-10%

+/-7%

interlayer alignment

+/-3mil

+/-2mil

Solder Mask Alignment

+/-2mil

+/-1mil

Minimum line width/line spacing

2.5/2.5mil

2.0/2.0mil

Smallest grommet

2.5mil

2.5mil

Minimum through hole

8mil (0.2mm)

6mil(0.15mm)

smallest micropore

4.0mil

3.0mil

Minimum media thickness

3.0mil

2.0mil

Minimum pad

12mil

10mil

Micropore Aperture Aspect Ratio

1：1

1：2：1