Lead Free Solder Alloy
Lead-free solder alloys have become popular and largely adopted as an alternative to lead-based solder alloys in the soldering of electronic components and electronic packaging
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SCS7H, an enhanced tin/copper lead free alloy, is highly recommended to directly replace existing SnCu0.7 solder in high temperature dipping applications. It offers benefits of good solderability and wettability, low drossing and low copper dissolution rate. This cost effective alloy has been designed to meet the most stringent requirements of the electronics industries. Properties Melting Point: 227 °C Packaging/Size Options Solder Bar: 25kg box Solder Wire: 20kg box Wire Diameter (mm): 0.3mm ~ 1.6mm, 2.0mm, 3.0mm |
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SAC305H solder in high temperature dipping applications. It offers benefits of good solderability and wettability, low drossing and low copper dissolution rate. This alloy has been designed to meet the most stringent requirements of the electronics industries. Properties Melting Point: 217 +/- 2 °C Tensile Strength: 58.5 MPa Toughness: 22.3 Mpa Packaging/Size Options Solder Bar: 25kg box Solder Wire: 20kg box Wire Diameter (mm): 0.3mm ~ 1.6mm, 2.0mm, 3.0mm |
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Viromet 347 & 349 is one of the high-performance lead free solder available in the industry. Viromet 347 & 349 solder bar can be used as a drop-in replacement for conventional SnPb solders in wave soldering and dipping application. It possesses superior mechanical properties and better reliability as compared to conventional SnPb solders. Properties Melting Point:202-207°C / 205-210°C Tensile Strength:76.17 Mpa / 72.03 Mpa Toughness:26.01 Mpa / 30.28 Mpa Cycle Fatigue Resistance:> 19000Nf / 9812Nf Packaging/Size Options Solder Bar:25kg box Solder Wire:20kg box Wire Diameter (mm):0.3mm ~ 1.6mm, 2.0mm, 3.0mm |
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SnCu0.7 is one of the high-performing, widely used low-cost Pb-free solder available in the industry. It can be used in wave soldering, dipping and HASL applications. It is available in the forms of solder bars and solder wires. Properties Melting Point: 227°C Tensile Strength: 38.72 Mpa Toughness: 21.99 Mpa Packaging/Size Options Solder Bar: 25kg box Solder Wire:20kg box Wire Diameter (mm): 0.3mm ~ 1.6mm, 2.0mm, 3.0mm |
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SAC305, Sn96.5Ag3.0Cu0.5 solder alloy was developed to have better fluidity and low drossing in dipping and wave soldering process. For stabilization of copper, Cu content in the soldering pot, Asahi SnAg3.0, Sn97.0Cu3.0 alloy will be recommended as a top up solder. Asahi SAC305 is also developed to have better wetting and spreadability. Asahi SAC305 and SnAg3.0 solder alloys are available in hand-casted and extruded bar form. They are also available in solid wire form for auto-feeding system. Asahi alloys could be produced into any forms upon users request and application. Properties Melting Point: 217 – 220 °C Tensile Strength: 48.548 MPa Toughness:23.126 Mpa Cycle Fatigue Resistance: 3600Nf Packaging/Size Options Solder Bar: 25kg box Solder Wire: 20kg box Wire Diameter (mm): 0.3mm ~ 1.6mm, 2.0mm, 3.0mm |
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SnAg3.5 is one of the high-performing Pb-free solder available in the industry. It can be used in wave soldering as well as dipping and HASL applications. It is available in the forms of solder bars and solder wires. Properties Melting Point:221°C Tensile Strength: 54.47 Mpa Toughness:20.56 Mpa Packaging/Size Options Solder Bar: 25kg box Solder Wire: 20kg box Wire Diameter (mm): 0.3mm ~ 1.6mm, 2.0mm, 3.0mm |
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SAC305H solder in high temperature dipping applications. It offers benefits of good solderability and wettability, low drossing and low copper dissolution rate. This alloy has been designed to meet the most stringent requirements of the electronics industries. Properties Melting Point:217 +/- 2 °C Tensile Strength: 58.5 MPa Toughness: 22.3 Mpa Packaging/Size Options Solder Bar; 25kg box Solder Wire: 20kg box Wire Diameter (mm): 0.3mm ~ 1.6mm, 2.0mm, 3.0mm |
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SnCu3.0 is one of the high-performing Pb-free solder available in the industry. It can be used in dipping soldering process. SnCu4.0 is effective solder alloy to minimize copper dissolution. Suitable to use on wire dipping as small as 0.03 mm. Our years of manufacturing experience has enabled us to precisely control and set stringent operating parameters to produce high quality bars. Properties Melting Point: 227-322°C / 228-340°C Tensile Strength:46.74 Mpa / 45.47 Mpa Toughness: 19.001 Mpa / 15.98 Mpa Packaging/Size Options Solder Bar: 25kg box Solder Wire: 20kg box Wire Diameter (mm):0.3mm ~ 1.6mm, 2.0mm, 3.0mm |
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SCS7, an enhanced tin/copper lead free alloy, is highly recommended to directly replace existing SnCu0.7 solder in the high temperature wave soldering applications. This alloy not only exhibits the excellent ductility of SnCu0.7 solder, it possesses superior mechanical strength both in ambient and high temperature environments. SCS7’s fatigue resistance is now comparable to tin/lead solder and as such, SCS7 has addressed the fundamental concerns of tin/copper alloys. Besides, it offers benefits of low drossing and good wettability. Its applications cover wave soldering, dipping processes, manual/auto soldering and solder joints touch up using solder wires. This cost effective alloy has been designed to meet the most stringent requirements of the electronics industries. Properties Melting Point: 227°C Tensile Strength:45.83 MPa Toughness: 25.54 MPa Cycle Fatigue Resistance: 3000 – 3500Nf Packaging/Size Options Solder Bar:25kg box Solid Wire:20kg box Wire Diameter (mm): 0.3mm ~ 1.6mm, 2.0mm, 3.0mm |
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SnBi58 low temperature solder alloy was developed to have better wettability in reflow soldering process. The flux residue is clear, colourless, and provide excellent electrical resistivity. Properties Melting Point: 138°C Packaging/Size Options Syringe and Jar. |
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