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Leaded Solder Alloy

All ‘Asahi’ solder are manufactured using the highest quality raw materials available. As the electronics industry imposes very stringent demands on the quality of soldering materials, Asahi uses only Virgin Grade materials to produce solder products that exceed International Industrial Specifications requirement.

More Information

Sn63Pb37 is one of the most common eutectic SnPb alloy used in different soldering processes before lead free implementation. SnPb alloy possess excellent wettability to various substrates and hence assures superior solderability.

It can be used in dipping application. It is available in the forms of solder bars and solder wires.

Properties

Melting Point:  183°C

Tensile Strength:  55.41 MPa

Toughness:  20.07 MPa

Packaging/Size Options

Solder Bar: 25kg box

Solder Wire: 20kg box

Wire Diameter (mm): 0.3mm ~ 1.6mm, 2.0mm, 3.0mm

Sn60Pb40 is one of the SnPb alloy used in different soldering processes before lead free implementation. It can be used in wave soldering as well as dipping and HASL applications. It is available in the forms of solder bars and solder wires.

Properties

Melting Point: 183 – 191°C

Tensile Strength: 56.77 MPa

Toughness: 18.50 MPa

Packaging/Size Options

Solder Bar: 25kg box

Solder Wire: 20kg box

Wire Diameter (mm): 0.3mm ~ 1.6mm, 2.0mm, 3.0mm

SnPb88Ag2 (HT88 AMX-66) is specially formulated for high temperature soldering. The residue is non-corrosive and exhibits excellent electrical and thermal insulation properties.

Properties

Soldering Temperature: > 400°C

Soldering Time: 1-3sec

Packaging/Size Options

Solder Wire: 20kg box

Wire Diameter (mm): 0.5mm ~ 1.6mm, 2.0mm

Sn62Pb36Ag2, using high purity chemicals, Sn62Pb36Ag2 gives a non-corrosive, minimal, clear yellow tinted residue due which exhibits excellent electrical and thermal insulation properties.

Properties

Soldering Temperature: 320-350°C

Soldering Time: 1-3sec

Packaging/Size Options

Solder Wire: 20kg box

Wire Diameter (mm): 0.5mm ~ 1.6mm, 2.0mm